Quantum-Well Laser Array Packaging
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ContributorsForewordChapter 1: IntroductionChapter 2: Overview of Laser Diode Degradation MechanismsChapter 3: Strain MeasurementChapter 4: Laser Facet Inspection by Imaging TechniquesChapter 5: Failure Prediction of High-Power Laser BarsChapter 6: Reduction of External Stresses by Improved Packaging TechniquesChapter 7: Degradation Modes and Related Defects in High-Power Laser BarsChapter 8: SummaryAPPENDIX: MATERIALS PROPERTIESIndex
Chapter 1: IntroductionChapter 2: Overview of Laser Diode Degradation MechanismsChapter 3: Strain MeasurementChapter 4: Laser Facet Inspection by Imaging TechniquesChapter 5: Failure Prediction of High-Power Laser BarsChapter 6: Reduction of External Stresses by Improved Packaging TechniquesChapter 7: Degradation Modes and Related Defects in High-Power Laser BarsChapter 8: SummaryAPPENDIX: MATERIALS PROPERTIESIndex
Chapter 3: Strain MeasurementChapter 4: Laser Facet Inspection by Imaging TechniquesChapter 5: Failure Prediction of High-Power Laser BarsChapter 6: Reduction of External Stresses by Improved Packaging TechniquesChapter 7: Degradation Modes and Related Defects in High-Power Laser BarsChapter 8: SummaryAPPENDIX: MATERIALS PROPERTIESIndex
Chapter 5: Failure Prediction of High-Power Laser BarsChapter 6: Reduction of External Stresses by Improved Packaging TechniquesChapter 7: Degradation Modes and Related Defects in High-Power Laser BarsChapter 8: SummaryAPPENDIX: MATERIALS PROPERTIESIndex
Chapter 7: Degradation Modes and Related Defects in High-Power Laser BarsChapter 8: SummaryAPPENDIX: MATERIALS PROPERTIESIndex
APPENDIX: MATERIALS PROPERTIESIndex
Quantum-well lasers offer the promise of lightning-fast data communications -- 10-to-100 times faster than broadband. While the architecture for these devices already exists, they suffer from material packaging problems. In this book the authors address this critical issue by providing researchers with state-of-the-art screening and packaging techniques not found in any other resource.