Green Electronics Design and Manufacturing
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Chapter 2. Electronics Industry Global Environmental Regulations
Chapter 3. Managing Corporate Strategy for Green Products
Chapter 4. Green Design Techniques
Chapter 5. Green Laminates and Printed Circuit Boards
Chapter 6. Converting to Lead-Free Electronics Manufacturing
Chapter 7. Managing Changes in Environmental Regulations
Chapter 8. The Green Supply Chain
Chapter 9. Testing Green Products
Chapter 10. Experimental Techniques for Green Product Verification
Successfully Design and Manufacture Reliable Environmentally-Friendly Electronic Products
This state-of-the-art resource brings together contributions by a team of experts from the total electronics supply chain who show how to master the strategy, design, test and implementation issues of meeting global environmental regulations.
Edited by the founder of the New England Lead-Free Consortium and filled with over 130 detailed illustrations, Green Electronics Design and Manufacturing features:
- Guidance for lead-free conversions while maintaining quality and reliability for printed circuit board production and rework of surface mount technology and palted through holes
- Restriction of hazardous substances (RoHS) compliance for hex-chrome and future halogen free issues
- Detailed coverage of global environmental regulations and their impact on manufacturing and design processes
- Techniques for managing corporate strategy and project design teams for green products
- Proven methods for testing and analyzing green products
- Proven methods for dealing with the adverse results of green production such as tin whiskers and finish interactions
Inside this Cutting-Edge Guide to Creating Green Electronic Products
• Basics, Test Methods, and Experimental Techniques for Green Quality and Reliability • Electronics Industry Global Environmental Regulations • Managing Corporate Strategy, Design Projects, and Teams for Green Products • Converting to Lead-Free Electronics Manufacturing, Including Rework, for SMT, BGA, and PTH • Conversion Issues with Design Changes, Laminates, IC Packages, and Printed Circuit Boards • Adverse Consequences of Lead-Free, Including Tin Whiskers and Finish Interactions • Nanotechnology and Its Future in Electronics Applications