Electronic Materials and Processes Handbook
Step 1. Download Adobe Digital Editions Both PC and Mac users will need to download Adobe Digital Editions to access their eBook. You can download Adobe Digital Editions at Adobe's website here.
Step 2. Register an Adobe ID if you do not already have one. (This step is optional, but allows you to open the file on multiple devices) Visit account.Adobe.com to register your Adobe account.
Step 3: Authorize Adobe Digital Editions using your Adobe ID. In Adobe Digital Editions, go to the Help menu. Choose “Authorize Computer.”
Step 4: Open your file with Adobe Digital Editions. Once you’ve linked your Adobe Digital Editions with your Adobe ID, you should be able to access your eBook on any device which supports Adobe Digital Editions and is authorized with your ID. If your eBook does not open in Adobe Digital Editions upon download, please contact customer service
Chapter 1: Development and Fabrication of IC ChipsChapter 2: Plastics, Elastomers, and CompositesChapter 3: Ceramics and GlassesChapter 4: MetalsChapter 5: Solder Technologies for Electronic Packaging and AssemblyChapter 6: Electroplating and Deposited Metallic CoatingsChapter 7: Printed Circuit Board FabricationChapter 8: Materials and Processes for Hybrid Microelectronics and Multichip ModulesChapter 9: Adhestives Underfills, and Coatings in Electronics AssembliesChapter 10: Thermal Management Materials and Systems Index
Chapter 3: Ceramics and GlassesChapter 4: MetalsChapter 5: Solder Technologies for Electronic Packaging and AssemblyChapter 6: Electroplating and Deposited Metallic CoatingsChapter 7: Printed Circuit Board FabricationChapter 8: Materials and Processes for Hybrid Microelectronics and Multichip ModulesChapter 9: Adhestives Underfills, and Coatings in Electronics AssembliesChapter 10: Thermal Management Materials and Systems Index
Chapter 5: Solder Technologies for Electronic Packaging and AssemblyChapter 6: Electroplating and Deposited Metallic CoatingsChapter 7: Printed Circuit Board FabricationChapter 8: Materials and Processes for Hybrid Microelectronics and Multichip ModulesChapter 9: Adhestives Underfills, and Coatings in Electronics AssembliesChapter 10: Thermal Management Materials and Systems Index
Chapter 7: Printed Circuit Board FabricationChapter 8: Materials and Processes for Hybrid Microelectronics and Multichip ModulesChapter 9: Adhestives Underfills, and Coatings in Electronics AssembliesChapter 10: Thermal Management Materials and Systems Index
Chapter 9: Adhestives Underfills, and Coatings in Electronics AssembliesChapter 10: Thermal Management Materials and Systems Index
Index
Micro-miniaturization in electronics--a necessity for personal communications devices like cell phones and PDAs--has radically altered the materials these electronics are made from.
This new edition, the first update of the handbook since 1993, is a complete rewrite, reflecting the great importance of engineering materials for thermal management and flexibility and microminiature sizes, and will be an invaluable tool to anyone working in electronic packaging, fabrication, or assembly design.* ALL NEW--A complete rewrite of the previous edition
* Details and characterizes every major material type, allowing engineers to make accurate, cost-effective design choices
* Full materials breakdown for high density packaging techniques
* Materials for communications wiring and cabling