Electronic Assembly Fabrication
Receive via shipping:
- Print bound version of the complete text
Preface Contributors Dedication Chapter 1: Printed Circuit History and Overview Chapter 2: Development and Fabrication of IC Chips Chapter 3: Packaging of IC Chips Chapter 4: Laminates and Prepregs as Circuit Board Base Materials Chapter 5: Printed Circuit Board Fabrication Chapter 6: Package and Component Attachment and Interconnection Chapter 7: Solder Materials and Processes for Electronic Assembly Fabrication Chapter 8: Printed Wiring Board Cleaning Chapter 9: Board Coating Materials and Processes Chapter 10: Flexible and Rigid Flexible Fabrication Chapter 11: Fabrication and Properties of Electronic Ceramics and Composites Chapter 12: Hybrid Microelectronics and Multichip Module Technologies Chapter 13: Environmental Considerations in Electronic Assembly Fabrication Index About the Editor
Dedication Chapter 1: Printed Circuit History and Overview Chapter 2: Development and Fabrication of IC Chips Chapter 3: Packaging of IC Chips Chapter 4: Laminates and Prepregs as Circuit Board Base Materials Chapter 5: Printed Circuit Board Fabrication Chapter 6: Package and Component Attachment and Interconnection Chapter 7: Solder Materials and Processes for Electronic Assembly Fabrication Chapter 8: Printed Wiring Board Cleaning Chapter 9: Board Coating Materials and Processes Chapter 10: Flexible and Rigid Flexible Fabrication Chapter 11: Fabrication and Properties of Electronic Ceramics and Composites Chapter 12: Hybrid Microelectronics and Multichip Module Technologies Chapter 13: Environmental Considerations in Electronic Assembly Fabrication Index About the Editor
Chapter 2: Development and Fabrication of IC Chips Chapter 3: Packaging of IC Chips Chapter 4: Laminates and Prepregs as Circuit Board Base Materials Chapter 5: Printed Circuit Board Fabrication Chapter 6: Package and Component Attachment and Interconnection Chapter 7: Solder Materials and Processes for Electronic Assembly Fabrication Chapter 8: Printed Wiring Board Cleaning Chapter 9: Board Coating Materials and Processes Chapter 10: Flexible and Rigid Flexible Fabrication Chapter 11: Fabrication and Properties of Electronic Ceramics and Composites Chapter 12: Hybrid Microelectronics and Multichip Module Technologies Chapter 13: Environmental Considerations in Electronic Assembly Fabrication Index About the Editor
Chapter 4: Laminates and Prepregs as Circuit Board Base Materials Chapter 5: Printed Circuit Board Fabrication Chapter 6: Package and Component Attachment and Interconnection Chapter 7: Solder Materials and Processes for Electronic Assembly Fabrication Chapter 8: Printed Wiring Board Cleaning Chapter 9: Board Coating Materials and Processes Chapter 10: Flexible and Rigid Flexible Fabrication Chapter 11: Fabrication and Properties of Electronic Ceramics and Composites Chapter 12: Hybrid Microelectronics and Multichip Module Technologies Chapter 13: Environmental Considerations in Electronic Assembly Fabrication Index About the Editor
Chapter 6: Package and Component Attachment and Interconnection Chapter 7: Solder Materials and Processes for Electronic Assembly Fabrication Chapter 8: Printed Wiring Board Cleaning Chapter 9: Board Coating Materials and Processes Chapter 10: Flexible and Rigid Flexible Fabrication Chapter 11: Fabrication and Properties of Electronic Ceramics and Composites Chapter 12: Hybrid Microelectronics and Multichip Module Technologies Chapter 13: Environmental Considerations in Electronic Assembly Fabrication Index About the Editor
Chapter 8: Printed Wiring Board Cleaning Chapter 9: Board Coating Materials and Processes Chapter 10: Flexible and Rigid Flexible Fabrication Chapter 11: Fabrication and Properties of Electronic Ceramics and Composites Chapter 12: Hybrid Microelectronics and Multichip Module Technologies Chapter 13: Environmental Considerations in Electronic Assembly Fabrication Index About the Editor
Chapter 10: Flexible and Rigid Flexible Fabrication Chapter 11: Fabrication and Properties of Electronic Ceramics and Composites Chapter 12: Hybrid Microelectronics and Multichip Module Technologies Chapter 13: Environmental Considerations in Electronic Assembly Fabrication Index About the Editor
Chapter 12: Hybrid Microelectronics and Multichip Module Technologies Chapter 13: Environmental Considerations in Electronic Assembly Fabrication Index About the Editor
Index About the Editor
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.
YOUR STEP-BY-STEP GUIDE THROUGH THE ENTIRE ELECTRONIC ASSEMBLY FABRICATION PROCESS
Electronic assemblies are the heart of all modern electronics. They house the essential chip, generate semiconductor input/output, and take care of the heat generated by the process. The explosive growth of communications and consumer electronics applications has suddenly made a knowledge of the fabrication process a very in-demand and lucrative skill.
Even beginners, with no advanced degrees or mathematical backgrounds will be able to quickly and easily learn the entire electronic assembly fabrication process with this well-illustrated comprehensive tutorial. Author Charles Harper, a hands-on expert and experienced author covers the assembly process from start to finish, delving into:
* Chips
* Boards
* Solders
* Packages
* Interconnections
* Substrates
* Deposition
* Cleaning
* Coating
* The latest environmental rules and constraints
ELECTRONIC ASSEMBLY FABRICATION will prove invaluable to nonspecialists and managers as well as engineers and technicians working in the development, marketing, or manufacture of electronic products, and anyone else who wants to get familiar with and profit from one of the major growth areas in the field of electronics.